The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jan. 03, 2019
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Wen Yang, Shenzhen, CN;

Riqing Zhang, Shanghai, CN;

Yu Xia, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 29/778 (2006.01); H01L 21/265 (2006.01); H01L 29/739 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 27/092 (2006.01); H01L 29/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823807 (2013.01); H01L 21/02164 (2013.01); H01L 21/02175 (2013.01); H01L 21/265 (2013.01); H01L 21/823857 (2013.01); H01L 27/092 (2013.01); H01L 29/66969 (2013.01); H01L 29/7391 (2013.01); H01L 29/778 (2013.01); H01L 29/78645 (2013.01); H01L 29/78681 (2013.01); H01L 29/24 (2013.01);
Abstract

In embodiments of the present disclosure, an ambient medium of a two-dimensional semiconductor is doped or an ambient medium of a semiconductor is locally filled with a solid material, to form a filled region, and an electronic device based on the two-dimensional semiconductor is implemented by means of a doping effect of the doped region or the filled region on a characteristic of the two-dimensional semiconductor. In the embodiments of the present disclosure, doping the two-dimensional semiconductor is not directly processing the two-dimensional semiconductor. Therefore, damage caused to the two-dimensional semiconductor in a doping process and device performance deterioration caused accordingly can be effectively reduced, and stability of device performance after doping is improved.


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