The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jun. 18, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Alvaro Garcia De Gorordo, Mountain View, CA (US);

Zhonghua Yao, Santa Clara, CA (US);

Sunil Srinivasan, San Jose, CA (US);

Sang Wook Park, Mountain View, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 21/0234 (2013.01); H01L 21/02112 (2013.01); H01L 21/02263 (2013.01); H01L 21/02348 (2013.01); B81C 2201/0138 (2013.01); H01L 21/0228 (2013.01); H01L 21/30655 (2013.01); H01L 21/31116 (2013.01);
Abstract

A method for etching silicon at cryogenic temperatures is provided. The method includes forming an inert layer from condensation of a noble gas at cryogenic temperatures on exposed surfaces such as the sidewalls of a feature to passivate the sidewalls prior to the etching process. The method further includes flowing a fluorine-containing precursor gas into the chamber to form a fluorine-containing layer on the inert layer. The method further includes exposing the fluorine-containing layer and the inert layer to an energy source to form a passivation layer on the exposed portions of the substrate and exposing the substrate to ions to etch the substrate.


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