The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jul. 05, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyun Joon Park, Suwon-si, KR;

Jin Yong Kim, Hwaseong-si, KR;

Bong Ki Park, Osan-si, KR;

Eun Sun Park, Yongin-si, KR;

Jae Hyeon Seo, Suwon-si, KR;

Young Chul Lee, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02074 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67173 (2013.01); H01L 21/67219 (2013.01); H01L 21/67703 (2013.01); H01L 21/67736 (2013.01); H01L 21/68707 (2013.01); H01L 21/67046 (2013.01); H01L 21/67739 (2013.01); H01L 21/67751 (2013.01); H01L 21/67757 (2013.01);
Abstract

Provided are a cleaning device and a method for driving the cleaning device which cleans a wafer after chemical mechanical polishing. The cleaning device includes a cleaning modules and a running beam, the running beam including a first blade and a second blade to insert or remove the wafer with respect to one of the cleaning modules in a second direction, the first blade and the second blade being fixed to the running beam and movable in the second direction, and the cleaning modules including an input module, a megasonic module, a first brush module, a second brush module and a drying module. The driving method includes performing an operation of inserting or removing the wafer in the second direction using the first blade in a first area; and performing an operation of inserting or removing the wafer in the second direction using the second blade in a second area.


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