The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Aug. 29, 2019
Canon Kabushiki Kaisha, Tokyo, JP;
Ryoji Kanri, Zushi, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A bonded wafer includes: a first wafer having a first surface and a second surface opposite to the first surface, and including a functional element on the first surface; and a second wafer in which a structure having at least one of a hole, a groove and a cavity is formed; wherein an annular protrusion is formed to have a shape to extend along an outer periphery on the second surface of the first wafer; wherein at least a portion of the second wafer is a reduced-diameter portion having a diameter smaller than an inner diameter of the annular protrusion; and wherein, under a state in which the reduced-diameter portion is fitted into a region surrounded by the annular protrusion of the first wafer, the second wafer is bonded to the second surface at least at the region.