The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Aug. 10, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Masahiro Nakajima, Tokyo, JP;

Kenichi Hirenzaki, Tokyo, JP;

Makoto Endo, Tokyo, JP;

Masanori Suzuki, Tokyo, JP;

Tomonaga Nishikawa, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/12 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/24 (2013.01); H01F 17/00 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/28 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/32 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 41/12 (2013.01); H01F 41/127 (2013.01); H01F 2017/048 (2013.01);
Abstract

Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.


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