IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11087909 B1

PDFFull Text
Date of Patent:
Aug. 10, 2021

Filed:

Jun. 07, 2018

Electronic component, electronic apparatus, and method for manufacturing electronic component

Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Yoshikazu Maruyama, Takasaki, JP;

Noriyuki Mabuchi, Takasaki, JP;

Ichiro Yokoyama, Takasaki, JP;

Masataka Kohara, Hidaka-gun, JP;

Keiichi Nozawa, Hidaka-gun, JP;

Masakazu Okazaki, Hidaka-gun, JP;

Chikako Yoshida, Hidaka-gun, JP;

Tomoyuki Oyoshi, Hidaka-gun, JP;

Ikuo Kakiuchi, Hidaka-gun, JP;

Masami Seto, Hidaka-gun, JP;

Assignee:

TAIYO YUDEN CO., LTD., Tokyo, JP;

Attorney:

Law Office of Katsuhiro Arai

Primary Examiner:

Tuyen T Nguyen

Int. Cl.
CPC ...
H01F 5/06 (2006.01); H01G 4/008 (2006.01); H05K 1/18 (2006.01); H01L 49/02 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H01F 27/32 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01F 5/06 (2013.01); H01F 27/022 (2013.01); H01F 27/292 (2013.01); H01F 27/327 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01L 28/60 (2013.01); H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10636 (2013.01);
Abstract

In an embodiment, an electronic component includes: an insulator partof rectangular solid shape; a coil elementprovided inside the insulator part; bottom electrodesprovided on a bottom faceof the insulator partand electrically connected to the coil element; a plating layerprovided in a manner overlapping each bottom electrodeso that its endon the bottom faceis away from the endof the bottom electrode; and a plating layerwhich is arranged between the bottom electrodeand the plating layerand overlaps the bottom electrode, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer. The electronic component can suppress generation of cracking in the insulator part.

Find Patent Forward Citations

Loading…