The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Feb. 20, 2020
Applicant:
Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;
Inventors:
Chun-Liang Chen, Hsinchu County, TW;
Hann-Jye Hsu, Hsinchu, TW;
Assignee:
Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G02F 1/1345 (2006.01); H05K 1/18 (2006.01); G09F 9/30 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1637 (2013.01); G02F 1/13452 (2013.01); G09F 9/301 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); G06F 2200/1612 (2013.01);
Abstract
The present disclosure provides a semiconductor package including a substrate, a display unit, a driving circuit, and at least one of memory. The substrate has a display region and a peripheral region. The display unit is disposed in the display region and electrically connects with the display unit. The memory is disposed in the peripheral region and electrically connected with the driving circuit. The driving circuit and the memory are spaced apart from each other.