The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Aug. 20, 2019
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Jason Dennis Patch, Columbus, OH (US);

Todd Eckhardt, Westerville, OH (US);

Jim Machir, Columbus, OH (US);

Richard Wade, Worthington, OH (US);

Jim Cook, Columbus, OH (US);

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 1/18 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); B06B 1/0622 (2013.01); G01L 9/0054 (2013.01);
Abstract

A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.


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