The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Nov. 10, 2016
Applicant:

Greene, Tweed Technologies, Inc., Wilmington, DE (US);

Inventors:

Timothy J. Edwards, Schwenksville, PA (US);

Joshua S. Kehler, York, PA (US);

Justin V. Jones, Philadelphia, PA (US);

Kevin F. Tsang, Philadelphia, PA (US);

Assignee:

Greene, Tweed Technologies, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16L 3/20 (2006.01); F16L 23/20 (2006.01); F16L 23/04 (2006.01); F16L 23/22 (2006.01); F16L 23/18 (2006.01);
U.S. Cl.
CPC ...
F16L 23/20 (2013.01); F16L 23/04 (2013.01); F16L 23/18 (2013.01); F16L 23/22 (2013.01);
Abstract

Sealing assemblies are described herein useful for high temperature applications, as well as applications involving aggressive chemical reactants, byproducts and/or reaction environments. The assemblies include an outer ring having an interior surface having two inwardly extending projections defining a seal receiving area, an inner ring having an exterior surface having two outwardly extending projections defining a seal receiving area; and a center sealing ring configured to be positioned within the seal receiving areas of the outer ring and the inner ring. When the sealing assembly is installed in a high temperature application, the elastomeric center sealing ring is enclosed within the outer and the inner rings so as to protect the center sealing ring while allowing for thermal expansion of the center sealing ring. In further embodiments, bonded sealing ring bodies are disclosed as well.


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