The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Nov. 15, 2017
Applicant:

Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US);

Inventors:

Lance R. Hubbard, Richland, WA (US);

Anthony Muscat, Tucson, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/38 (2006.01); C23C 18/18 (2006.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1687 (2013.01); C23C 18/1637 (2013.01); C23C 18/1642 (2013.01); C23C 18/1692 (2013.01); C23C 18/1834 (2013.01); C23C 18/1882 (2013.01); C23C 18/38 (2013.01); H01L 21/288 (2013.01); H01L 21/768 (2013.01); H01L 21/76873 (2013.01); H01L 21/76898 (2013.01);
Abstract

Methods for forming thin, pinhole-free conformal metal layers on both conducting and non-conducting surfaces, where the morphology and properties of the metal layers are tuned to meet desired parameters by adjusting the concentration of ionic liquids during the deposition process. The formed metal films contain tunable properties for solar and electronic use and provide specific advantages for non-conducting surfaces, which are otherwise unsuitable for electroplating without the presence of the formed metal films. The disclosed methods do not require the presence of a voltage or external electric field but form the metal films through an electroless technique using electrostatic interactions between negatively charged nanoparticles. In addition, the disclosed methods are compatible with solution phase processing and eliminate the need to transfer the surfaces into a vacuum chamber for a chemical or physical vapor deposition to form a metal layer.


Find Patent Forward Citations

Loading…