The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Dec. 14, 2018
Applicant:

Ab7 Innovation S.a.s.u., Deyme, FR;

Inventors:

René Chelle, Deyme, FR;

David Nguyen, Toulouse, FR;

Arnaud Vilbert, Baziége, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/06 (2006.01); C08K 5/092 (2006.01); C08K 5/20 (2006.01); C08K 5/00 (2006.01); A01N 25/10 (2006.01); C08K 5/3432 (2006.01); C08K 5/49 (2006.01); C08G 69/34 (2006.01); C09J 177/08 (2006.01); C08K 5/02 (2006.01); C08L 77/08 (2006.01); C08K 11/00 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); A01N 25/10 (2013.01); C08G 69/34 (2013.01); C08K 5/0008 (2013.01); C08K 5/0058 (2013.01); C08K 5/02 (2013.01); C08K 5/092 (2013.01); C08K 5/20 (2013.01); C08K 5/3432 (2013.01); C08K 5/49 (2013.01); C08K 11/00 (2013.01); C08L 77/08 (2013.01); C09J 177/08 (2013.01);
Abstract

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.


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