The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11084902 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 10, 2021

Filed:

Apr. 05, 2017
Applicant:

Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;

Inventors:

Kiyoshi Nishioka, Himeji, JP;

Hideyuki Takeda, Himeji, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 64/02 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
C08G 64/0233 (2013.01); H05K 1/0313 (2013.01); H05K 3/107 (2013.01);
Abstract

Provided is an aliphatic polycarbonate resin having excellent water repellency. Also provided are a partition material, a substrate and a method for producing the same, a method for producing a wiring substrate, and a wiring forming method. The aliphatic polycarbonate resin of the present invention comprises a structural unit represented by the following formula (1): wherein R, R, and Rare each independently a hydrogen atom, a C-Calkyl group, or a C-Caryl group; X is a substituent having a fluorine atom; and R, R, and Rmay be the same or different; and


Find Patent Forward Citations

Nishioka, Kiyoshi. (2021). Aliphatic polycarbonate resin, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming method (U.S. Patent No. 11084902). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11084902

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