The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Mar. 20, 2018
Applicant:
Daegu Gyeongbuk Institute of Science & Technology, Daegu, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 61/02 (2006.01); B32B 27/28 (2006.01); C08L 65/04 (2006.01); C08L 83/04 (2006.01); B32B 15/08 (2006.01); C09J 5/02 (2006.01);
U.S. Cl.
CPC ...
C08G 61/025 (2013.01); B32B 15/08 (2013.01); B32B 27/283 (2013.01); C08L 65/04 (2013.01); C08L 83/04 (2013.01); C09J 5/02 (2013.01); C08G 2261/3424 (2013.01); C09J 2483/006 (2013.01); C09J 2483/008 (2013.01);
Abstract
The present invention provides a selective bonding method of polymer substrates. The present invention allows selective interfacial bonding between a polymer substrate and a parylene layer by using a mask pattern and plasma treatment, and enables the formation of a three-dimensional structure by injecting a fluid into a non-bonded area.
Kim, So. (2021). Selective bonding method of polymer substrates (U.S. Patent No. 11084898). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11084898
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile