The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Aug. 26, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Virgil Cotoco Ararao, McKinney, TX (US);

John Charles Ehmke, Garland, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00873 (2013.01); B81B 7/007 (2013.01); H01L 23/315 (2013.01); H01L 23/3135 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0172 (2013.01); H01L 24/13 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/03334 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05016 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/09181 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01);
Abstract

In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.


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