The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Aug. 02, 2019
Applicant:

Casio Computer Co., Ltd., Tokyo, JP;

Inventor:

Hideki Takahashi, Ome, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 7/027 (2019.01); B32B 27/08 (2006.01); B32B 5/18 (2006.01); B32B 27/06 (2006.01); B32B 27/36 (2006.01); B29C 35/08 (2006.01); B29K 67/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/027 (2019.01); B29C 35/0805 (2013.01); B32B 5/18 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B29C 2035/0822 (2013.01); B29K 2067/003 (2013.01); B32B 2250/24 (2013.01);
Abstract

A resin molded sheet includes: a base material made of resin; a first thermal expansion layer including a thermally expandable material and provided on a first surface of the base material; and a second thermal expansion layer including a thermally expandable material and provided on a second surface of the base material, wherein the first thermal expansion layer is provided at least on a first region, where the base material is deformed by the first thermal expansion layer, on the first surface of the base material, and the second thermal expansion layer is provided at least in a second region, where the base material is deformed by the second thermal expansion layer, on the second surface of the base material.


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