The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Mar. 08, 2018
Applicant:

Andrew Cook, Fort Erie, CA;

Inventor:

Andrew Cook, Fort Erie, CA;

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29B 15/14 (2006.01); B29C 64/118 (2017.01); B29C 64/379 (2017.01); B29C 64/209 (2017.01); B29C 70/34 (2006.01); B29C 70/38 (2006.01); B29B 15/12 (2006.01); B33Y 40/00 (2020.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29B 15/14 (2013.01); B29C 64/118 (2017.08); B29C 64/209 (2017.08); B29C 64/379 (2017.08); B29C 70/347 (2013.01); B29C 70/382 (2013.01); B29B 15/122 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract

An improved three-dimensional structure and method and system of making same is provided, wherein the method for forming the three-dimensional structure comprises: coating a filament with a curable resin; directing a first portion of the coated filament around a plurality of pins fixed to and extending outwardly from a frame, the coated filament directed to intersect according to a pre-set pattern, the coated filament forming a first filament layer; directing a second portion of the coated filament about said pins forming one or more subsequent filament layers aligned and in contact with the first filament layer, the filament layers collectively forming a filament stack, the filament stack having a predetermined height and defining the intersecting panel elements; and curing the curable resin such that it hardens and retains the individual filament layers forming the filament stack in a three-dimensional shape.


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