The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Mar. 07, 2019
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventors:

Taiki Hashizume, Kariya, JP;

Makoto Souda, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01); H05K 5/03 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1422 (2013.01); H05K 1/0204 (2013.01); H05K 1/181 (2013.01); H05K 5/03 (2013.01); H05K 7/2039 (2013.01); H05K 7/20909 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10174 (2013.01);
Abstract

An electronic module includes a circuit board having a mounting surface; a heat generating component mounted on the mounting surface; a frame supporting the circuit board; a cover covering the heat generating component and the mounting surface; and a heatsink mounted on the mounting surface. The heatsink includes at least one wall including a particular wall to which the heat generating component is attached. The heatsink further includes a shade portion provided at the at least one wall. The shade portion is located between the cover and the heat generating component in a direction perpendicular to the mounting surface.


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