The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Mar. 10, 2016
Applicant:

Sumitomo Electric Printed Circuits, Inc., Koka, JP;

Inventors:

Hiroshi Ueda, Koka, JP;

Kousuke Miura, Koka, JP;

Yoshihito Yamaguchi, Koka, JP;

Yuka Urabe, Koka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H05K 3/46 (2006.01); H05K 3/24 (2006.01); H05K 1/16 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 27/32 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4673 (2013.01); H01F 17/0013 (2013.01); H01F 27/327 (2013.01); H01F 41/041 (2013.01); H01F 41/043 (2013.01); H01F 41/127 (2013.01); H05K 1/165 (2013.01); H05K 3/241 (2013.01); H05K 3/4626 (2013.01); H05K 3/4644 (2013.01); H01F 2017/0073 (2013.01); H05K 2203/1476 (2013.01); H05K 2203/1572 (2013.01);
Abstract

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is ½ or more and 5 or less.


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