The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Mar. 27, 2018
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventors:

Rui Peng, Beijing, CN;

Qinghe Wang, Beijing, CN;

Xiang Wan, Beijing, CN;

Xinwei Gao, Beijing, CN;

Xinxin Wang, Beijing, CN;

Zhaokang Fan, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H01L 27/20 (2006.01); H01L 41/113 (2006.01); H01L 41/193 (2006.01); H01L 41/45 (2013.01); H04R 19/00 (2006.01); H01L 41/04 (2006.01);
U.S. Cl.
CPC ...
H04R 31/003 (2013.01); H01L 27/20 (2013.01); H01L 41/04 (2013.01); H01L 41/1132 (2013.01); H01L 41/193 (2013.01); H01L 41/45 (2013.01); H04R 19/005 (2013.01); H04R 2231/003 (2013.01);
Abstract

The present disclosure provides a composite electrode, an acoustic sensor using the composite electrode, and a manufacturing method of the composite electrode. The composite electrode includes a conductive layer, and a semiconductor high-molecular polymer layer formed on the conductive layer. The semiconductor high-molecular polymer layer has a three-dimensional mesh structure. The acoustic sensor includes a base; the above-mentioned composite electrode formed on the base; an organic layer formed on the composite electrode; and a top electrode formed on the organic layer.


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