The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Dec. 23, 2019
Applicant:

Motorola Solutions, Inc., Chicago, IL (US);

Inventors:

Andrew P. Miehl, Boca Raton, FL (US);

Deborah A. Gruenhagen, Southwest Ranches, FL (US);

Geng Xiang Lee, Penang, MY;

Karl F. Mueller, Sunrise, FL (US);

Assignee:

MOTOROLA SOLUTIONS, INC., Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 29/00 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/04 (2013.01); H04R 29/004 (2013.01); H04R 2201/003 (2013.01);
Abstract

Methods and systems for verification of an environmental seal provided by an encapsulant coating of a bottom-ported MEMS microphone package. A purposeful acoustic leak is provided on an upper surface of a package housing (in the form of an additional acoustic port) and a sealing material is applied to an outer surface of the package housing. A properly applied encapsulant coating will completely seal the additional acoustic port on the upper surface of the package housing. However, the placement of the additional acoustic port on the upper surface of the package housing will have a significant, detectable effect on the frequency response of the microphone if it is not completely sealed by the encapsulant coating. Accordingly, the environmental seal provided by the encapsulant coating is verified by confirming, based on the acoustic frequency response testing, that the encapsulant coating has effectively sealed the additional acoustic port on the upper surface of the package housing.


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