The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Jan. 31, 2018
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventor:
Motoi Yamauchi, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H01L 41/187 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02897 (2013.01); H01L 41/1873 (2013.01); H03H 9/05 (2013.01); H03H 9/059 (2013.01); H03H 9/0523 (2013.01); H03H 9/0547 (2013.01); H03H 9/13 (2013.01); H03H 9/145 (2013.01);
Abstract
An acoustic wave device includes: a first substrate made of a piezoelectric material; an acoustic wave element located on the first substrate; a bump located on the first substrate; a second substrate located on the first substrate through the bump, the second substrate facing the first substrate across an air gap; and a support layer that is located in at least a part of a periphery of the first substrate, is in contact with a side surface of the first substrate, and has a less linear thermal expansion coefficient than the first substrate.