The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Dec. 27, 2018
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Jock T. Bovington, La Mesa, CA (US);

Vipulkumar K. Patel, Breinigsville, PA (US);

Dominic F. Siriani, Allentown, PA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); H01S 5/042 (2006.01); H01S 5/343 (2006.01); H01S 5/40 (2006.01); H01S 5/34 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0215 (2013.01); H01S 5/021 (2013.01); H01S 5/0218 (2013.01); H01S 5/042 (2013.01); H01S 5/343 (2013.01); H01S 5/3412 (2013.01); H01S 5/4025 (2013.01); G02B 6/42 (2013.01); G02B 6/4234 (2013.01);
Abstract

A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.


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Bovington, Jock. (2021). Iii-v laser platforms on silicon with through silicon vias by wafer scale bonding (U.S. Patent No. 11081856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11081856

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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