The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Dec. 07, 2017
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Dai, Tokyo, JP;

Junya Imamoto, Tokyo, JP;

Yu Ogihara, Tokyo, JP;

Masayoshi Suzuta, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); H01G 11/80 (2013.01); H01M 50/116 (2021.01); H01G 11/16 (2013.01); H01M 50/124 (2021.01); H01M 50/183 (2021.01);
U.S. Cl.
CPC ...
H01M 50/116 (2021.01); B32B 7/12 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); H01G 11/16 (2013.01); H01G 11/80 (2013.01); H01M 50/124 (2021.01); H01M 50/183 (2021.01); B32B 2264/107 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/10 (2013.01); Y02E 60/13 (2013.01);
Abstract

Packaging material for a power storage device, comprising at least a substrate layer, an adhesive layer, a metal foil layer and a sealant layer wherein the sealant layer contains an inorganic filler and an occupying ratio of the inorganic filler relative to the total thickness of the sealant layer is 5 to 50%, and also to a packaging material for a power storage device, comprising a substrate layer, a barrier layer and also to a packaging material for power storage device, which comprises a substrate layer, a barrier layer and a sealant layer arranged in this order wherein the barrier layer is made of a metal foil and has a corrosion inhibition treatment layer at least at a side of the sealant layer, and the sealant layer is formed directly on the corrosion inhibition layer, has a thickness of 5 to 30 μm, and contains a high melting point material.


Find Patent Forward Citations

Loading…