The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Dec. 19, 2017
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Takamichi Fujii, Kanagawa, JP;

Takayuki Naono, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/187 (2006.01); H01L 41/09 (2006.01); H01L 41/316 (2013.01); H01L 41/313 (2013.01); H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
H01L 41/187 (2013.01); H01L 41/0805 (2013.01); H01L 41/09 (2013.01); H01L 41/094 (2013.01); H01L 41/0973 (2013.01); H01L 41/1876 (2013.01); H01L 41/313 (2013.01); H01L 41/316 (2013.01);
Abstract

A piezoelectric element is obtained using a method including: preparing a first structure; preparing a second structure; disposing a first facing electrode layer of the first structure to face a first surface of a vibration plate substrate and bonding the first structure to the first surface of the vibration plate substrate; processing the vibration plate substrate into a vibration plate by polishing or etching a second surface of the vibration plate substrate to which the first structure is bonded; preparing a laminate structure by disposing a second facing electrode layer of the second structure to face an exposed surface of the vibration plate and bonding the second structure to the vibration plate; and removing at least a part of a first silicon substrate of the first structure and a second silicon substrate of the second structure from the laminate structure.


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