The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Feb. 23, 2015
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Andreea Boca, Sherman Oaks, CA (US);
Daniel C. Law, Arcadia, CA (US);
Joseph Charles Boisvert, Thousand Oaks, CA (US);
Nasser H. Karam, La Canada, CA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0687 (2012.01); H01L 31/0693 (2012.01); H01L 31/043 (2014.01); H01L 31/0725 (2012.01); H01L 31/18 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0687 (2013.01); H01L 21/2007 (2013.01); H01L 31/043 (2014.12); H01L 31/0693 (2013.01); H01L 31/06875 (2013.01); H01L 31/0725 (2013.01); H01L 31/1844 (2013.01); H01L 31/1892 (2013.01); H01L 31/1896 (2013.01); H01L 31/18 (2013.01); Y02E 10/544 (2013.01);
Abstract
A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.