The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Mar. 24, 2019
Applicant:

Solarpaint Ltd., Nahsholim, IL;

Inventors:

Eran Maimon, Nahsholim, IL;

Ramon Joseph Albalak, Haifa, IL;

Oded Rozenberg, Nahsholim, IL;

Esther Westreich, Neve Yarak, IL;

Assignee:

SOLARPAINT LTD., Kibbutz Nahsholim, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0392 (2006.01); H01L 27/142 (2014.01); H01L 31/18 (2006.01); H01L 31/042 (2014.01); H01L 31/054 (2014.01); H01L 31/0352 (2006.01);
U.S. Cl.
CPC ...
H01L 31/03926 (2013.01); H01L 27/142 (2013.01); H01L 31/035281 (2013.01); H01L 31/042 (2013.01); H01L 31/0543 (2014.12); H01L 31/18 (2013.01); Y02E 10/52 (2013.01);
Abstract

Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened physical characteristics making them more suitable for use in mechanically challenging or stressful environments. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit toughened thermal characteristics making them more suitable for use in environmentally challenging applications. Semiconductor substrates and semiconductor devices produced from such substrates, such as photovoltaic (PV) cells, may exhibit sufficiently toughened characteristics and increase impact resistance to permit packaging in non-rigid and light weight encapsulating layer(s). Semiconductor substrates and semiconductor devices produced from such substrates may exhibit sufficient flexibility to permit for rolling up during shipment and or for non-destructive deformation during deployment over uneven surfaces. Semiconductor devices produced from such substrates may exhibit sufficient flexibility to permit repeated mechanical and/or thermal stresses without failure.


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