The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Sep. 18, 2018
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Zia Hossain, Tempe, AZ (US);

Tetsuro Asano, Oizumi-machi, JP;

Syoji Miyahara, Kumagaya, JP;

Yasuyuki Sayama, Aizuwakamatsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/872 (2006.01); H01L 29/40 (2006.01); H01L 29/36 (2006.01); H01L 29/10 (2006.01); H01L 29/812 (2006.01); H01L 21/3065 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/0657 (2013.01); H01L 29/0696 (2013.01); H01L 29/0865 (2013.01); H01L 29/1004 (2013.01); H01L 29/36 (2013.01); H01L 29/404 (2013.01); H01L 29/4236 (2013.01); H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/66848 (2013.01); H01L 29/7397 (2013.01); H01L 29/7806 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 29/8122 (2013.01); H01L 29/8128 (2013.01); H01L 29/872 (2013.01); H01L 21/3065 (2013.01); H01L 29/0878 (2013.01); H01L 29/1095 (2013.01); H01L 29/41766 (2013.01);
Abstract

A semiconductor device structure includes a region of semiconductor material comprising a first conductivity type, an active region, and a termination region. A first active trench structure is disposed in the active region, and a second active trench structure is disposed in the active region and laterally separated from the first active trench by an active mesa region having a first width. A first termination trench structure is disposed in the termination region and separated from the second active trench by a transition mesa region having a second width and a higher carrier charge than that of the active mesa region. In one example, the second width is greater than the first width to provide the higher carrier charge. In another example, the dopant concentration in the transition mesa region is higher than that in the active mesa region to provide the higher carrier charge. The semiconductor device structure exhibits improved device ruggedness including, for example, improve unclamped inductive switching (UIS) performance.


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