The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Apr. 17, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Haruhiko Terada, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); G11C 13/00 (2006.01); H01L 45/00 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2436 (2013.01); G11C 5/025 (2013.01); G11C 5/06 (2013.01); G11C 13/0002 (2013.01); H01L 27/2427 (2013.01); H01L 45/04 (2013.01); H01L 27/0688 (2013.01);
Abstract

A semiconductor device includes a plurality of first selection lines extending in a first direction and disposed side by side in a second direction, the second direction intersecting with the first direction, a first metal wiring line formed in a layer above the first selection line layer, a first through wiring line penetrating an insulating layer formed on the first selection line layer, and coupling a first line of the plurality of first selection lines and the first metal wiring line to each other, a second through wiring line penetrating the first selection line layer, the second through wiring line having one end coupled to the first metal wiring line, a first storage element having a first terminal, and a second terminal coupled to the first line, and a first drive circuit coupled to another end of the second through wiring line, and drives the plurality of first selection lines.


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