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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11081503 B1

PDFFull Text
Date of Patent:
Aug. 03, 2021

Filed:

Jul. 12, 2019

Array substrate and method of mounting integrated circuit using the same

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventor:

Dae Geun Lee, Hwaseong-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:

H.C. Park & Associates, PLC

Primary Examiner:

Hoa B Trinh

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 27/12 (2006.01); G02F 1/1345 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/13458 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/81 (2013.01); H05K 1/111 (2013.01); H01L 27/3276 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/06152 (2013.01); H01L 2224/81132 (2013.01); H01L 2924/3511 (2013.01); H05K 1/189 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/09954 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/166 (2013.01); Y02P 70/50 (2015.11); Y10T 29/49005 (2015.01);
Abstract

An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

Find Patent Forward Citations

Lee, Dae. (2021). Array substrate and method of mounting integrated circuit using the same (U.S. Patent No. 11081503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11081503

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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