Dynamic resource management in circuit bound array architecture

Abstract

Systems and methods for dynamically assigning memory array die to CMOS die of a plurality of stacked die during memory operations are described. The plurality of stacked die may be vertically stacked and connected together via one or more vertical through-silicon via (TSV) connections. The memory array die may only comprise memory cell structures (e.g., vertical NAND strings) without column decoders, row decoders, charge pumps, sense amplifiers, control circuitry, page registers, or state machines. The CMOS die may contain support circuitry necessary for performing the memory operations, such as read and write memory operations. The one or more vertical TSV connections may allow each memory array die of the plurality of stacked die to communicate with or be electrically connected to one or more CMOS die of the plurality of stacked die.