The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Apr. 16, 2018
Applicant:
Primo1d, Grenoble, FR;
Inventors:
Delphine Rolland, Grenoble, FR;
Christopher Mackanic, Le Versoud, FR;
Gianfranco Andia Vera, Grenoble, FR;
Emmanuel Arene, Biviers, FR;
Assignee:
PRIMO1D, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/67138 (2013.01); H01L 21/6838 (2013.01); H01L 24/78 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/8521 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85234 (2013.01); H01L 2224/85815 (2013.01);
Abstract
A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.