The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Nov. 02, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tsuneo Hamaguchi, Tokyo, JP;

Tomohiro Tanishita, Tokyo, JP;

Shota Sato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/00 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); H05K 9/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/00 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H05K 7/20 (2013.01); H05K 9/00 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2023/4025 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An electromagnetic wave absorption sheet is arranged to contact an upper surface and side surfaces of an electronic component mounted on a wiring board, a heat conduction plate is arranged to contact the electromagnetic wave absorption sheet, a heat transfer sheet is arranged to contact the heat conduction plate, and a heat dissipation member is arranged to contact the heat transfer sheet. Heat conductive particles contained in the heat transfer sheet contact a flat surface portion of the heat conduction plate. The electromagnetic wave absorption sheet, the heat conduction plate, and the heat transfer sheet are interposed between the heat dissipation member and the electronic component, as a heat conduction member for conducting heat generated in the electronic component and the like to the heat dissipation member.


Find Patent Forward Citations

Loading…