The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Apr. 04, 2018
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Shusaku Shibata, Osaka, JP;
Yoshihiro Kawamura, Osaka, JP;
Hayato Takakura, Osaka, JP;
Takahiro Takano, Osaka, JP;
Shuichi Wakaki, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/552 (2006.01); H05K 1/09 (2006.01); H04N 5/225 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/552 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H05K 1/09 (2013.01);
Abstract
An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.