The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Dec. 12, 2019
Applicant:
Amulaire Thermal Technology, Inc., New Taipei, TW;
Inventors:
Assignee:
AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3672 (2013.01); H01L 23/3737 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/13055 (2013.01);
Abstract
An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a first polymer composite layer, a second polymer composite layer, a first ceramic layer, a second ceramic layer, and a heat dissipation layer. The first ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the first layer of chips, and the second ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the second layer of chips.