The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Feb. 20, 2020
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Inventors:
Takenori Yamada, Ibo Hyogo, JP;
Tomohiro Iguchi, Himeji Hyogo, JP;
Assignees:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/14 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 23/142 (2013.01); H01L 23/4924 (2013.01);
Abstract
A semiconductor device of embodiments includes a first semiconductor chip; a metal plate having a first plane and a second plane facing the first plane and including a first ceramic plate provided between the first plane and the second plane; and a first insulating board provided between the first semiconductor chip and the metal plate and facing the first plane, in which the first ceramic plate does not exist between the first semiconductor chip and the second plane.