The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Dec. 31, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Peter John Holverson, Dallas, TX (US);
Sudtida Lavangkul, Murphy, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76873 (2013.01); H01L 21/76814 (2013.01); H01L 21/76843 (2013.01); H01L 21/76853 (2013.01); H01L 23/53238 (2013.01);
Abstract
A method includes electroplate depositing a first metal layer to a first thickness on a metal seed layer, rinsing the first metal layer with deionized water, and after the first rinse process, drying the wafer. The method also includes performing one or more additional electroplating processes that respectively deposit an additional metal layer to a second thickness over the first metal layer, performing an additional rinse process that rinses the additional metal layer with deionized water, and performing an additional drying processes that dries the wafer.