The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Dec. 05, 2018
Texas Instruments Incorporated, Dallas, TX (US);
Bernard Kaebin Andres Ancheta, Quirino, PH;
Emerson Mamaril Enipin, Angeles, PH;
John Carlo Cruz Molina, Bataan, PH;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A method of making a semiconductor device includes mounting at least two semiconductor dies to a die pad of a leadframe in spaced apart relation to each other, the leadframe having a plurality of preformed leads, electrically connecting each semiconductor die to at least one preformed lead of the leadframe, forming a molding structure including at least part of the semiconductor dies and the preformed leads of the leadframe, and forming a trench in the molding structure in a space between the at least two semiconductor dies, the trench separating the die pad into first and second die pad portions.