The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Dec. 04, 2018
Applicant:

Arcsoft Corporation Limited, Hangzhou, CN;

Inventors:

Dong Wook Nam, Suwon-si, KR;

Byung Il Min, Suwon-si, KR;

Kwang Sue Park, Seoul, KR;

Bong Seok Kim, Gwangju-si, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00046 (2013.01); G06K 9/0004 (2013.01);
Abstract

A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.


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