The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Aug. 30, 2018
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Mitsuaki Kato, Kanagawa, JP;

Akihiro Goryu, Kanagawa, JP;

Kenji Hirohata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01K 7/01 (2006.01); G01B 7/16 (2006.01); G01L 1/20 (2006.01); H01L 29/16 (2006.01); H01L 25/18 (2006.01); G06F 30/20 (2020.01); G06F 30/23 (2020.01); G06F 30/367 (2020.01);
U.S. Cl.
CPC ...
G01R 31/2607 (2013.01); G01B 7/18 (2013.01); G01K 7/01 (2013.01); G01L 1/20 (2013.01); G06F 30/20 (2020.01); G06F 30/23 (2020.01); G06F 30/367 (2020.01); G01B 7/20 (2013.01); G01K 2217/00 (2013.01); H01L 25/18 (2013.01); H01L 29/1608 (2013.01);
Abstract

An inspection device comprises: a detecting unit that is connected to a plurality of semiconductor chips having mutually different rates of change of electrical resistance with respect to stress loading direction, and that detects an electrical resistance value of each semiconductor chip from electric current flowing in each semiconductor chip; a first memory unit that is used to hold model data meant for converting an electrical resistance value into a characteristic value indicating at least either temperature, or stress, or strain; a converting unit that converts the electrical resistance value of each semiconductor chip as detected by the detecting unit into the characteristic value using the model data held in the first memory unit; and a second memory unit that is used to store the characteristic value, which is obtained by conversion by the converting unit, as time-series data for each of the plurality of semiconductor chips.


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