The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Feb. 16, 2017
Applicant:
Basf SE, Ludwigshafen am Rhein, DE;
Inventors:
Claus Gabriel, Griesheim, DE;
Simon Gramlich, Hirschberg, DE;
Rainer Ostermann, Recklinghausen, DE;
Florian Richter, Mannheim, DE;
Raphael Dabbous, Riehen, CH;
Thomas Meier, Mannheim, DE;
Wolfgang Schrof, Neuleiningen, DE;
Assignee:
BASF SE, Ludwigshafen am Rhein, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/06 (2006.01); C08K 5/3465 (2006.01); C08K 5/357 (2006.01); C08K 5/46 (2006.01); B29C 64/153 (2017.01); B33Y 70/00 (2020.01); C09B 67/02 (2006.01); C08L 77/02 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); B29C 64/153 (2017.08); B33Y 70/00 (2014.12); C08K 5/3465 (2013.01); C08K 5/357 (2013.01); C08K 5/46 (2013.01); C08L 77/02 (2013.01); C09B 67/0097 (2013.01);
Abstract
The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process.