The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Oct. 20, 2017
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventors:
Masanobu Mizusaki, Sakai, JP;
Tadashi Ohtake, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/40 (2006.01); C09J 4/06 (2006.01); C09J 163/00 (2006.01); G02F 1/00 (2006.01); H01Q 1/00 (2006.01); H01Q 21/00 (2006.01); C08G 59/44 (2006.01); C09K 3/10 (2006.01); H01L 27/12 (2006.01); H01Q 1/38 (2006.01); H01Q 21/06 (2006.01); H01Q 3/44 (2006.01); G02F 1/1339 (2006.01); H01Q 13/22 (2006.01); H01Q 3/34 (2006.01);
U.S. Cl.
CPC ...
C08G 59/44 (2013.01); C08G 59/40 (2013.01); C09K 3/10 (2013.01); G02F 1/1339 (2013.01); H01L 27/1255 (2013.01); H01Q 1/38 (2013.01); H01Q 3/34 (2013.01); H01Q 3/44 (2013.01); H01Q 13/22 (2013.01); H01Q 21/06 (2013.01); H01Q 21/064 (2013.01); H01Q 21/065 (2013.01); C09K 2003/1068 (2013.01); C09K 2003/1084 (2013.01);
Abstract
A seal material composition according to the present invention includes: an epoxy compound including an epoxy group; and a polymerizable epoxy curing agent including a polymerizable functional group configured for cross-linking the epoxy groups and for radical polymerization in a single molecule.