The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Jul. 12, 2016
Applicant:
Bostik SA, La Plaine Saint-Denis, FR;
Inventors:
Christophe Robert, Thourotte, FR;
Marc Brestaz, Compiegne, FR;
Ludovic Sallet, Compiegne, FR;
Jeremie Peyras-Carratte, Pont Sainte Maxence, FR;
Assignee:
BOSTIK SA, La Plaine Saint-Denis, FR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D 77/20 (2006.01); B32B 7/12 (2006.01); B32B 25/14 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 27/30 (2006.01); B65D 43/02 (2006.01);
U.S. Cl.
CPC ...
B65D 77/2096 (2013.01); B32B 7/12 (2013.01); B32B 25/14 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/36 (2013.01); B65D 43/02 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/31 (2013.01); B32B 2435/02 (2013.01); B65D 2577/2025 (2013.01);
Abstract
A multilayer film: the amounts of the monomers (i), (ii) and (iii) used in the polycondensation such that the softening temperature of C1 is below 190° C. A process for producing the multilayer film by co-extrusion blow-molding. A resealable packaging comprising a PET-based receptacle and a seal of said multilayer film, the heat-sealable and cleavable layer (C) of which is heat-sealed on the receptacle.