The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Apr. 05, 2019
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Nobuko Oikawa, Tokyo-to, JP;

Minoru Azakami, Tokyo-to, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B42D 25/328 (2014.01); B42D 25/455 (2014.01); B42D 25/46 (2014.01); G03H 1/00 (2006.01); G03H 1/02 (2006.01); B29C 65/48 (2006.01); B42D 25/41 (2014.01); B42D 25/355 (2014.01); B42D 25/47 (2014.01); B42D 25/475 (2014.01); B29C 65/00 (2006.01); G09F 3/00 (2006.01); C09D 11/02 (2014.01); D21H 21/42 (2006.01); B29C 65/82 (2006.01); B32B 37/12 (2006.01); C09J 7/35 (2018.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 37/18 (2006.01); C09D 11/037 (2014.01); C09D 11/106 (2014.01); C09D 127/06 (2006.01); C09D 131/04 (2006.01); C09D 133/14 (2006.01); C09J 11/06 (2006.01); C09J 133/08 (2006.01); D21H 21/40 (2006.01); B29L 17/00 (2006.01); B29K 633/00 (2006.01); B29K 667/00 (2006.01);
U.S. Cl.
CPC ...
B42D 25/328 (2014.10); B29C 65/48 (2013.01); B29C 65/482 (2013.01); B29C 65/483 (2013.01); B29C 65/8223 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29C 66/733 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); B42D 25/355 (2014.10); B42D 25/41 (2014.10); B42D 25/455 (2014.10); B42D 25/46 (2014.10); B42D 25/47 (2014.10); B42D 25/475 (2014.10); C09D 11/02 (2013.01); C09D 11/037 (2013.01); C09D 11/106 (2013.01); C09D 127/06 (2013.01); C09D 131/04 (2013.01); C09D 133/14 (2013.01); C09J 7/35 (2018.01); C09J 11/06 (2013.01); C09J 133/08 (2013.01); D21H 21/40 (2013.01); D21H 21/42 (2013.01); G03H 1/0011 (2013.01); G03H 1/0248 (2013.01); G03H 1/0252 (2013.01); G09F 3/0292 (2013.01); B29C 65/485 (2013.01); B29C 66/72328 (2013.01); B29K 2633/00 (2013.01); B29K 2667/003 (2013.01); B29L 2017/001 (2013.01); B32B 2037/1253 (2013.01); B32B 2305/347 (2013.01); B32B 2307/542 (2013.01); B32B 2310/0843 (2013.01); B32B 2310/14 (2013.01); B32B 2317/12 (2013.01); B32B 2333/00 (2013.01); B32B 2367/00 (2013.01); B32B 2425/00 (2013.01); C09J 2301/414 (2020.08); C09J 2433/00 (2013.01); G03H 2240/50 (2013.01); G03H 2250/35 (2013.01);
Abstract

An object of the present invention is to provide a thin volume hologram sheet to be embedded sufficiently resistant to a mechanical stress such as a stress including a tensile stress, a shear stress and a compression stress at the time of processing even under a heating condition, a forgery prevention paper and a card using the same. The object is achieved by providing a volume hologram sheet to be embedded comprising a volume hologram layer, and a substrate disposed only on one side surface of the volume hologram layer using an adhesion means, wherein a peeling strength of the volume hologram layer and the substrate is 25 gf/25 mm or more.


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