The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Jul. 12, 2017
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Akihiro Endo, Annaka, JP;

Yuki Tanaka, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); C09D 7/61 (2018.01); C08J 7/044 (2020.01); C08J 5/18 (2006.01); C08J 7/04 (2020.01); C08K 3/22 (2006.01); C09D 5/00 (2006.01); C09D 183/04 (2006.01); C09K 5/14 (2006.01); H01L 23/373 (2006.01); C08J 7/043 (2020.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); C08J 5/18 (2013.01); C08J 7/042 (2013.01); C08J 7/043 (2020.01); C08J 7/044 (2020.01); C08K 3/22 (2013.01); C09D 5/00 (2013.01); C09D 7/61 (2018.01); C09D 183/04 (2013.01); C09K 5/14 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); C08J 2379/08 (2013.01); C08J 2483/07 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01);
Abstract

Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.


Find Patent Forward Citations

Loading…