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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11077593 B1

PDFFull Text
Date of Patent:
Aug. 03, 2021

Filed:

Feb. 15, 2019

Housings for electronic devices

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Douglas Weber, San Francisco, CA (US);

Stephen P. Zadesky, Portola Valley, CA (US);

Stephen Brian Lynch, Portola Valley, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:

Brownstein Hyatt Farber Schreck, LLP

Primary Examiner:

James C Yager

Int. Cl.
CPC ...
B29C 45/16 (2006.01); B29C 37/00 (2006.01); B29C 45/14 (2006.01); B23K 26/382 (2014.01); C23F 1/00 (2006.01); C23F 1/16 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01); B29K 55/02 (2006.01); B29K 69/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1657 (2013.01); B23K 26/382 (2015.10); B29C 37/0082 (2013.01); B29C 45/14311 (2013.01); B29C 45/1671 (2013.01); C23F 1/00 (2013.01); C23F 1/16 (2013.01); B29C 45/14344 (2013.01); B29C 2045/14327 (2013.01); B29K 2055/02 (2013.01); B29K 2069/00 (2013.01); B29K 2705/00 (2013.01); B29L 2031/3481 (2013.01); B32B 2355/02 (2013.01); B32B 2369/00 (2013.01); B32B 2457/00 (2013.01); Y10T 428/13 (2015.01); Y10T 428/1352 (2015.01); Y10T 428/1355 (2015.01); Y10T 428/24008 (2015.01); Y10T 428/24273 (2015.01); Y10T 428/24521 (2015.01); Y10T 428/31678 (2015.04);
Abstract

Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

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