The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Mar. 26, 2019
Applicant:

The United States of America, As Represented BY the Secretary of the Navy, Crane, IN (US);

Inventors:

David Bartlett, Mitchell, IN (US);

Elizabeth O'Neill, Washington, IN (US);

Robert Moser, Heltonville, IN (US);

Roger Dickerhoof, Bloomington, IN (US);

Carl Miller, Bedford, IN (US);

Joshua Jeffers, Loogootee, IN (US);

Bryan Woosley, Bedford, IN (US);

James Merryfield, Bedford, IN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/00 (2006.01); C08L 63/00 (2006.01); B29C 45/26 (2006.01); B29C 45/64 (2006.01); C08G 73/00 (2006.01); B29K 63/00 (2006.01); B29L 31/36 (2006.01); H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14639 (2013.01); B29C 45/0001 (2013.01); B29C 45/14549 (2013.01); B29C 45/26 (2013.01); B29C 45/64 (2013.01); C08G 73/00 (2013.01); C08L 63/00 (2013.01); B29K 2063/00 (2013.01); B29L 2031/36 (2013.01); H01R 43/005 (2013.01);
Abstract

A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.


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