The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Mar. 30, 2016
Applicant:
Siemens Aktiengesellschaft, Munich, DE;
Inventors:
Oliver Hofacker, Berlin, DE;
Ursus Krueger, Berlin, DE;
Assignee:
SIEMENS AKTIENGESELLSCHAFT, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/115 (2006.01); B22D 23/00 (2006.01); C23C 24/04 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/153 (2017.01); B22F 12/00 (2021.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B22F 3/115 (2013.01); B22D 23/003 (2013.01); B22F 12/00 (2021.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); C23C 24/04 (2013.01); B22F 10/10 (2021.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); Y02P 10/25 (2015.11);
Abstract
The present disclosure relates to manufacturing methods. The teachings thereof may be used to manufacture a component in which the component is applied by thermal spraying with a coating jet carrying building material. For example, a method for manufacturing a component may include: producing a mold for the component layer-by-layer on a building platform using a generative process incorporating data describing the mold; building the component in the mold by filling the mold with a building material using thermal spraying with a coating jet; and removing the mold from the component.