The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Nov. 30, 2018
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yasuhiko Morimoto, Ashigara-kami-gun, JP;

Katsuya Yamamoto, Ashigara-kami-gun, JP;

Satoru Okada, Ashigara-kami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/12 (2006.01); A61B 8/00 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
A61B 8/546 (2013.01); A61B 8/12 (2013.01); A61B 8/44 (2013.01); A61B 8/445 (2013.01); A61B 8/4444 (2013.01); A61B 8/4483 (2013.01); A61B 8/4488 (2013.01); B06B 1/0622 (2013.01);
Abstract

An ultrasonic endoscope has an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged; a backing material layer on a back side of a plurality of ultrasonic transducers, a wiring board including a plurality of electrode pads that are connected to the plurality of ultrasonic transducers; a plurality of shield cables each including a signal wire and a shield member, a wiring portion in which the plurality of signal wires are electrically connected to the plurality of electrode pads; a ground portion that is electrically connected to the shield members and that have heat conductivity; and a first heat conductive member that extends beyond the backing material layer to a side opposite to the ultrasonic transducer array with respect to the backing material layer and that is thermally connected to the ground portion.


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