The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Feb. 25, 2019
Tdk Corporation, Tokyo, JP;
Shuichi Takizawa, Tokyo, JP;
Hironori Sato, Tokyo, JP;
Atsushi Yoshino, Tokyo, JP;
Hideki Kachi, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
A circuit modulecomprises: a wiring structure; at least one electronic componentarranged on the upper surface of the wiring structure; an insulating resin layerwhich is provided on the upper surface of the wiring structureand in which at least one electronic componentis embedded; and a metal layerprovided on the upper surface of the insulating resin layer. The surface roughness of the portion Sdirectly above each electronic component on the upper surface of the insulating resin layeris expressed as R. The surface roughness of the portion Sother than the portion directly above all the electronic components on the upper surface of the insulating resin layeris expressed as R. At least one Rsatisfies the condition: R>R