The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Mar. 16, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Mi Sun Hwang, Suwon-si, KR;

Deok Man Kang, Suwon-si, KR;

Jun Hyeong Jang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01);
Abstract

An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.


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